close
close

AMD’s new CPUs are here, but I won’t buy them yet

AMD’s new CPUs are here, but I won’t buy them yet

Key findings

  • The first Ryzen 9000 series CPUs had some performance issues and were recalled due to testing problems.
  • A hidden Windows administrator account degraded benchmark results and caused problems between AMD’s tests and independent testers.
  • However, the upcoming Ryzen 9000X3D chips with more cache and potential for full overclocking support are worth the wait.



AMD’s highly anticipated launch of the Zen 5-powered Ryzen 9000 series has been anything but smooth. Stock recalls, performance discrepancies, and testing issues have all caused problems for AMD’s new CPUs.

While the specs of AMD’s 9000-series CPUs look fantastic on paper, there are a few reasons why I’ll wait for the more powerful Ryzen 9000X3D chips—and you should, too.


1 Too many flaws in the Vanilla Ryzen 9000

First of all, there are too many general performance issues with AMD’s new CPUs.

AMD’s first batch of Ryzen 9000 processors was delayed due to quality issues uncovered at the last minute during packaging testing. These issues were so severe that AMD decided to recall all units already shipped to retailers and OEMs. While this move was prudent, it raises significant concerns about the reliability of the early production units.


Additionally, AMD’s performance numbers did not match the results of independent testers. AMD’s initial internal tests showed an average performance increase of 9% in 1080p gaming over the previous generation Ryzen 7000 CPUs. However, many independent testers claim the performance increase is 2-5%.

Further testing revealed that AMD used a hidden Windows administrator account during internal testing. The Windows system account’s privileges limit Zen4 and Zen5’s CPU performance and degrade benchmark results. Independent testers confirmed this after seeing an additional 2-4% performance boost when using the Windows administrator account.


So logging in as an administrator should solve the problem, right? Yes, but the administrator account is not the same as logging in as a Windows administrator. It is a hidden administrator account that requires the Command Prompt (CMD) to activate. Although anyone can access this account, it still has two major drawbacks.

First, it is a new account, so you will have to reinstall all the software and set up all your files and settings, which is a huge hassle. Second, logging into this administrator account significantly increases the system’s vulnerability to security threats, as it grants elevated privileges that could be exploited by malware.

A 2-4% performance boost is simply not worth all the hassle of installing apps, setting up the account, and risking your security.

2 Ryzen 9000X3D has more cache

These issues aside, the upcoming X3D releases offer a more compelling reason to consider upgrading: AMD’s 3D V-Cache technology. AMD’s X3D technology enabled a significant 10-15% performance increase for the Ryzen 7000 and 5000 CPUs.


CPU caches are important components in processors that keep applications running smoothly. With the upcoming Ryzen 9000X3D CPUs getting an additional 64MB of L3 cache, we expect lower latencies and improved performance in cache-sensitive applications like gaming.

With AMD promising a 16% IPC (instructions per clock cycle) increase for its new Zen5 architecture, the Ryzen 9000X3D chips will offer an even bigger boost in gaming performance compared to the last generation Ryzen 7000X3D.

3 Potential for full overclocking support

One of the most exciting prospects for the Ryzen 9000 Series X3D variants is the possibility of full overclocking support. Previous X3D models were limited in this regard due to the complexity of thermal management with the additional 3D V-Cache.


Anandtech reports that the regular 9000-series CPUs use a mix of 4nm and 3nm manufacturing processes from TSMC. As for the 3D V-Cache chiplets, Guru3D reports that the third-generation 3D V-Cache may use a 5nm manufacturing process, which should bring significant improvements over the second-generation 3D V-Cache, which used a 7nm process node (according to Tom’s Hardware).

The compact manufacturing process of the 3D V-Cache makes overclocking easier due to the lower heat generation and other benefits of a smaller process node. And based on the last two generations of the 3D V-Cache, smaller process nodes seem to enable better overclocking support.

The first generation of AMD’s 3D V-Cache on Zen3 enabled memory overclocking. Then Zen4 came and Precision Boost Overdrive (PBO) was enabled. With lower heat generation, the third generation is ready to support overclocking.


This could make the Ryzen 9000X3D a great option if you want to squeeze every ounce of performance out of your system, and if that’s true, it would be worth the wait. However, it’s important to note that the potential for full overclocking support is based on trends and speculation that the upcoming 3D V-Cache will use a 5nm process node.

In my opinion, it’s very likely that a 5nm 3D V-Cache will result in higher CPU clock speeds. So a Ryzen 9000X3D CPU will not only get more cache, but potentially have higher clock speeds than the currently available Ryzen 9000 base CPUs. To ensure full overclocking support, AMD would likely need to do more than just manufacture the 3D V-Cache on a 5nm process. However, in a PC Gamer interview with Donny Woligroski (AMD’s senior technical marketing manager), it was emphasized that AMD is doing more than just adding V-Cache to the chip.

Full overclocking support, although vague, is certainly possible.


4 Zen 5 X3D is just around the corner

Finally, the upcoming release of the Zen 5 X3D processors is another reason to hold off on buying the current Ryzen 9000 series. Rumors suggest that these CPUs could hit the market as early as the end of the year or possibly early next year. They are expected to offer not only improved performance, but also improved efficiency and a better price compared to the first Zen 5 versions.

Leave a Reply

Your email address will not be published. Required fields are marked *